2018 International Medical Devices and Supplies Fair in Hong Kong
Ohio Development Services Agency
The Ohio Development Services Agency, in partnership with the Hong Kong Trade Development Council, are seeking Ohio companies to showcase their products and services at the International Medical Devices and Supplies Fair 2018 in Hong Kong, China.
With an increasing global demand for medical devices, Ohio businesses can participate in the USA Pavilion or the Startup Zone at one of the leading healthcare fairs in the Asia-Pacific region. With the opportunity to engage with more than 10,000 buyers from more than 60 countries, this an opportunity companies do not want to miss!
The USA Pavilion Booth Package includes:
- Hotel accommodations
- Marketing
- Business matchmaking
- Site-visits
- Speaking opportunities
- Access to media
For more information and to register, click HERE. For interested companies that have been in operating for less than three years, contact Thien.Bui@development.ohio.gov or Tom.Bainbridge@development.ohio.gov.
Grant Opportunity
The Ohio International Market Access Grant for Exporters (IMAGE) will provide a 50 percent reimbursement to qualifying companies for eligible expenses. For more information, click HERE.
OEDA seeks host communities for its Annual Summit
For Immediate Release OEDA seeks host communities for its Annual Summit For the first time, location proposals sought for 400+ attendee conference COLUMBUS, OHIO – TUESDAY, NOVEMBER 12 – Today, the Ohio Economic Development Association (OEDA) announced that is...
Coming Soon: Governor’s Cup Deadline November 26
JobsOhio Coming Soon: Governor's Cup Deadline November 26 It's that time of year when economic developers ensure Site Selection Magazine has a complete tally of the economic development wins from all 50 states. In Site Selection's 2023 Governor's Cup ranking,...
Request For Qualifications (RFQ) for Design Services
Ottawa County Improvement Corporation Request For Qualifications (RFQ) for Design Services Please click below for specific information: 8.28.24-RFQ-Description-1 (1)